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TMCNet:  Advanced IC Packaging Technologies, Materials, and Markets 2012

[January 30, 2013]

Advanced IC Packaging Technologies, Materials, and Markets 2012

(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets ( has announced the addition of the "Advanced IC Packaging Technologies, Materials, and Markets 2012" report to their offering.

The Internet has altered the way in which the world and people function, communicate, and connect. The hardware which drives this, and the need for more bandwidth to support it, is driving technological advances in many new ways. Much progress has been made in front end manufacturing, but the current need is to increase Internet speeds by focusing on the "backend," or the packaging end of the chip making process, known as "More than Moore," after Moore's Law.

NVR in this report, Advanced IC Packaging Technologies, Materials and Markets, 2012 Edition, captures those advanced IC packaging methods which are critical to success in maintaining technological leadership.

Chapter 3, Stacked Packages, explains the basics of this critical packaging technology, along with coverage of the latest products. Forecasts include units, prices, packaging revenue, package types, device types, first-level interconnection, and applications.

Chapter 4, TSV Market (3-D and 2.5-D stacking) is covered in depth, including various methods of connecting the devices, with coverage of the latest new products and processes. Unit projections of both 2.5-D and 3-D are forecast, as are the identified potential markets for these technologies.

Chapter 5, System in Package (SiP) Solutions, presents information on the evolving market for ICs combined with passive devices within a single package. New product introductions are presented. Forecasts include units, prices, packaging revenue, device types, interconnection, and applications.

Chapter 6, Fan-in QFN Packages, examines the latest new product introductions plus market forecasts for Fan-in QFN Packages. Forecasts include units, prices, packaging revenue and applications.

Chapter 7, Wafer-Level Packages Including Fanout WLP, presents technological background on the technology, the latest new Fan-Out WLP product introductions, plus market forecasts for WLP by pitch and Fan-Out WLPs.

Chapter 8, Flip Chip and Wire Bonding Interconnection, and Wire Bond Materials, reviews first-level package interconnection. Flip chip and wire bonding unit and package revenue forecasts are provided within the package, as well as flip chip bare die forecasts. Extensive flip chip forecasts are presented by device type and I/O count ranges, and by package type and I/O count range, both unit and revenue. New product highlights are also presented.

Chapter 9, Substrates, presents the market, including an overview of substrate types and materials, and highlights of recent developments in substrates. Forecasts are provided for substrate units, area, and revenue by package type and substrate material.

Chapter 10, Rising Chip Packaging Markets and Key Applications for IC Devices , includes forecasts of global IC units, revenue, and units by package families. The most popular package and I/O count range is presented for the most prominent IC devices. Key applications for small-footprint, high-performance packages are highlighted in this chapter.

Key Topics Covered: Chapter 1: Introduction Chapter 2: Executive Summary Chapter 3: Stacked Packages Chapter 4: Through Silicon Vias, 3-D and 2.5-D Integration Chapter 5: System in Package (SiP) Solutions Chapter 6: Fan-in QFN Packages Chapter 7: Wafer-Level Packages including Fan-out WLPs Chapter 8: Flip Chip and Wire Bonding Interconnection, and Chapter 9: Substrates Chapter 10: Rising Chip Packaging Markets and Key Companies Mentioned - 3D Glass Solutions - Advanced Semiconductor Engineering (ASE) - Alerta Corp.

- Amkor Technology - BeSang, Inc.


- DNP America - Dow Electronic Materials - ENSEM.SE/CMP-GC - Endicott Interconnect Technologies - Fogale - Fujitsu Advanced Technologies - Fujitsu Integrated Microtechnology - Georgia Institute of Technology - Hitachi Chemical Co.

- IBM - Industrial Technology Research Institute (ITRI) - Invensas Corp.

- KTH Royal Institute of Technology - Korea Advanced Institute of Science and - Korea Electronics Technology Institute, Packaging - LETI, CEA - MicroTEC - MultiTest - NANIUM S.A.

- National Chiao Tung University - Oracle Labs - Osaka University - Palo Alto Research Center - Rambus, Inc.

- Research Center - SPTS Technology - STATS ChipPac - STMicroelectronics - Samsung Electronics - Shinko Electronic Industries - Siliconware Precision Industries - Smoltek - Taiwan Semiconductor Manufacturing Corp (TSMC) - Technology (KAIST) - Texas Instruments - Tohoku University - University of California, Irvine For more information visit CONTACT: Research and Markets, Laura Wood, Senior Manager. Fax from USA: 646-607-1907 Fax from rest of the world: +353-1-481-1716 Sector: Packaging ( cat_id=329&campaign_id=ffkzl8) ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at on the world wide web. Inquiries to


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